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Hsin-Chu, Taiwan

Aptos Corporation

USPTO Granted Patents = 16

EPO Patents = 1

Trademarks = 2

Forward Citations = 412

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17 inventors (with patents filed for the assignee):

Tsing-Chow Wang (9 out of 9 patents)

Te-Sung Wu (3 out of 3 patents)

Kuolung Lei (2 out of 10 patents)

4. Chi Shen Ho (2 out of 2 patents)

5. Chang-Ming Lin (2 out of 5 patents)

6. Chung W Ho (2 out of 22 patents)

7. David Johnson (1 out of 3 patents)

8. Terry Bissonnette (1 out of 1 patent)

9. Tony Shen (1 out of 2 patents)

10. Erh-Kong Chieh (1 out of 4 patents)

11. Charles Lin (1 out of 17 patents)

12. Min Chih Hsuan (1 out of 2 patents)

13. Chi-Shen Ho (1 out of 1 patent)

14. Kuo Lung Lei (1 out of 1 patent)

15. Dino Lei (1 out of 1 patent)

16 patents: Sort by Forward Citations

1. 11263612 - Systems and methods for point of sale data synchronization (2022-03-01),

2. 7208344 - Wafer level mounting frame for ball grid array packaging, and method of making and using the same (2007-04-24),

3. 7141875 - Flexible multi-chip module and method of making the same (2006-11-28),

4. 7078272 - Wafer scale integration packaging and method of making and using the same (2006-07-18),

5. 7008867 - Method for forming copper bump antioxidation surface (2006-03-07),

6. 6913946 - Method of making an ultimate low dielectric device (2005-07-05),

7. 6846360 - Apparatus and method for bubble-free application of a resin to a substrate (2005-01-25),

8. 6784089 - Flat-top bumping structure and preparation method (2004-08-31),

9. 6674173 - Stacked paired die package and method of making the same (2004-01-06),

10. 6635585 - Method for forming patterned polyimide layer (2003-10-21),

11. 6544878 - Microelectronic fabrication having formed therein terminal electrode structure providing enhanced barrier properties (2003-04-08),

12. 6448171 - Microelectronic fabrication having formed therein terminal electrode structure providing enhanced passivation and enhanced bondability (2002-09-10),

13. 6424037 - Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball (2002-07-23),

14. 6362087 - Method for fabricating a microelectronic fabrication having formed therein a redistribution structure (2002-03-26),

15. 6316831 - Microelectronic fabrication having formed therein terminal electrode structure providing enhanced barrier properties (2001-11-13),

Aptos Corporation is a leading retail technology solutions provider that offers cloud-based, on-premise, and hybrid solutions to retailers worldwide. With a comprehensive suite of retail management software, Aptos helps retailers streamline their operations, improve customer experiences, and drive revenue growth. Their solutions cover areas such as point of sale, merchandise planning, order management, CRM, analytics, and more. Aptos serves a diverse range of retailers across various industries, including fashion, specialty, grocery, and department stores.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

16 Patents

#29 in Hsin-Chu

#956 in Taiwan

#36,684 in the World

Hsin-Chu, Taiwan

Aptos Corporation

Forward Citations = 412

17 inventors:

Tsing-Chow Wang (9 out of 9 patents)

Te-Sung Wu (3 out of 3 patents)

Kuolung Lei (2 out of 10 patents)

4. Chi Shen Ho (2 out of 2 patents)

5. Chang-Ming Lin (2 out of 5 patents)

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