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Hsinchu, Taiwan

Aptos Corporation

USPTO Granted Patents = 16

% Expired Patents = 62.5

EPO Patents = 1

Forward Citations = 415

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17 inventors (with patents filed for the assignee):

Tsing-Chow Wang (9 out of 9 patents)

Te-Sung Wu (3 out of 3 patents)

Kuolung Lei (2 out of 10 patents)

4. Chi Shen Ho (2 out of 2 patents)

5. Chang-Ming Lin (2 out of 5 patents)

6. Chung W Ho (2 out of 22 patents)

7. David Johnson (1 out of 3 patents)

8. Terry Bissonnette (1 out of 1 patent)

9. Tony Shen (1 out of 2 patents)

10. Erh-Kong Chieh (1 out of 4 patents)

11. Charles Lin (1 out of 17 patents)

12. Min Chih Hsuan (1 out of 2 patents)

13. Chi-Shen Ho (1 out of 1 patent)

14. Kuo Lung Lei (1 out of 1 patent)

15. Dino Lei (1 out of 1 patent)

16 patents: Sort by Forward Citations

1. 11263612 - Systems and methods for point of sale data synchronization (2022-03-01),

2. 7208344 - Wafer level mounting frame for ball grid array packaging, and method of making and using the same (2007-04-24),

3. 7141875 - Flexible multi-chip module and method of making the same (2006-11-28),

4. 7078272 - Wafer scale integration packaging and method of making and using the same (2006-07-18),

5. 7008867 - Method for forming copper bump antioxidation surface (2006-03-07),

6. 6913946 - Method of making an ultimate low dielectric device (2005-07-05),

7. 6846360 - Apparatus and method for bubble-free application of a resin to a substrate (2005-01-25),

8. 6784089 - Flat-top bumping structure and preparation method (2004-08-31),

9. 6674173 - Stacked paired die package and method of making the same (2004-01-06),

10. 6635585 - Method for forming patterned polyimide layer (2003-10-21),

11. 6544878 - Microelectronic fabrication having formed therein terminal electrode structure providing enhanced barrier properties (2003-04-08),

12. 6448171 - Microelectronic fabrication having formed therein terminal electrode structure providing enhanced passivation and enhanced bondability (2002-09-10),

13. 6424037 - Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball (2002-07-23),

14. 6362087 - Method for fabricating a microelectronic fabrication having formed therein a redistribution structure (2002-03-26),

15. 6316831 - Microelectronic fabrication having formed therein terminal electrode structure providing enhanced barrier properties (2001-11-13),

Company Overview

Aptos Corporation, headquartered in Hsinchu, Taiwan, specializes in advanced semiconductor solutions and technologies. The company focuses on the development and manufacturing of high-performance integrated circuits and related components, catering to various industries including consumer electronics, telecommunications, and automotive sectors. Aptos is committed to innovation in semiconductor design and production, leveraging cutting-edge research to enhance efficiency and performance in electronic devices.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

16 Patents

#188 in Hsinchu

#997 in Taiwan

#37,831 in the World

Hsinchu, Taiwan

Aptos Corporation

Forward Citations = 415

17 inventors:

Tsing-Chow Wang (9 out of 9 patents)

Te-Sung Wu (3 out of 3 patents)

Kuolung Lei (2 out of 10 patents)

4. Chi Shen Ho (2 out of 2 patents)

5. Chang-Ming Lin (2 out of 5 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Aptos Corporation. Retrieved from https://idiyas.com/company/aptos

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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