Te-Sung Wu

Title: Te-Sung Wu: Innovator in Microelectronic Fabrication

Introduction

Te-Sung Wu is a notable inventor based in San Jose, California, recognized for his contributions to microelectronic fabrication. He holds three patents that showcase his innovative approaches to enhancing electrical contact structures and terminal electrode designs.

Latest Patents

One of his latest patents is titled "Flat-top bumping structure and preparation method." This invention outlines a method for creating an electrical contact bump structure on a substrate. The process involves providing a substrate with a bond pad and a passivation layer, forming under bump metallurgy, and depositing an electrically conductive material into a specifically shaped opening in a sacrificial blanket.

Another significant patent is focused on "Microelectronic fabrication having formed therein terminal electrode structure providing enhanced passivation and enhanced bondability." This method details the fabrication of a microelectronic device, including the formation of a patterned bond pad layer and a patterned passivation layer. The resulting terminal electrode structure enhances both passivation and bondability, which are critical for microelectronic applications.

Career Highlights

Te-Sung Wu is currently employed at Aptos Corporation, where he continues to innovate in the field of microelectronics. His work has significantly impacted the efficiency and reliability of microelectronic devices.

Collaborations

Throughout his career, Wu has collaborated with esteemed colleagues, including Tsing-Chow Wang and Erh-Kong Chieh. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Te-Sung Wu's contributions to microelectronic fabrication through his patents and collaborative efforts highlight his role as a leading inventor in the field. His work continues to influence advancements in technology and microelectronics.