The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2002
Filed:
May. 05, 2000
Applicant:
Inventors:
Tsing-Chow Wang, Cupertino, CA (US);
Te-Sung Wu, San Jose, CA (US);
Erh-Kong Chieh, Cupertino, CA (US);
Assignee:
Aptos Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/302 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/302 ;
Abstract
Within a method for fabricating a microelectronic fabrication there is first provided a substrate. There is then formed over the substrate a patterned bond pad layer. There is also formed over the substrate and in electrical communication with the patterned bond pad layer a patterned redistribution layer, wherein the patterned redistribution layer is formed employing a plating method. The method is particularly economical for fabricating the microelectronic fabrication.