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For the Inventor, By the Inventor

Cupertino, CA, United States of America

Tsing-Chow Wang

This inventor holds 9 USPTO granted patents. Top assignee: Aptos Corporation. Active years: 2001-2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsing-Chow Wang. Retrieved from https://idiyas.com/inventor/tsing-chow-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 9

% Patents Active = 55.6

Average Co-Inventor Count = 1.6

ph-index = 7

Forward Citations = 258(Granted Patents)


Company Filing History:

goldMedal9 out of 16 
 
Aptos Corporation
 patents

Years Active: 2001-2004

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9 patents (USPTO):Explore Patents
1. 6784089 - Flat-top bumping structure and preparation method (2004-08-31),
2. 6674173 - Stacked paired die package and method of making the same (2004-01-06),
3. 6635585 - Method for forming patterned polyimide layer (2003-10-21),
4. 6544878 - Microelectronic fabrication having formed therein terminal electrode structure providing enhanced barrier properties (2003-04-08),
5. 6448171 - Microelectronic fabrication having formed therein terminal electrode structure providing enhanced passivation and enhanced bondability (2002-09-10),
6. 6424037 - Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball (2002-07-23),
7. 6362087 - Method for fabricating a microelectronic fabrication having formed therein a redistribution structure (2002-03-26),
8. 6316831 - Microelectronic fabrication having formed therein terminal electrode structure providing enhanced barrier properties (2001-11-13),
9. 6281041 - Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball (2001-08-28),

Title: Tsing-Chow Wang: Innovator in Semiconductor Technology

Introduction

Tsing-Chow Wang is a prominent inventor based in Cupertino, California, known for his significant contributions to semiconductor technology. With a total of nine patents to his name, Wang has made remarkable advancements in the field, particularly in electrical contact structures and semiconductor packaging.

Latest Patents

Wang's latest patents include a method for creating a flat-top bumping structure and a stacked paired die package. The flat-top bumping structure patent describes a method for making an electrical contact bump on a substrate, which involves providing a substrate with a bond pad and a passivation layer. This method enhances the electrical contact structure by forming an under bump metallurgy and depositing an electrically conductive material into a specifically shaped opening in a sacrificial blanket. The stacked paired die package patent introduces a design that incorporates at least a pair of functional semiconductor dies, allowing for increased density and performance. This innovative architecture enables multiple input/output interconnections, significantly improving the efficiency of semiconductor packages.

Career Highlights

Wang is currently employed at Aptos Corporation, where he continues to push the boundaries of semiconductor technology. His work has not only contributed to the advancement of the industry but has also positioned him as a key figure in the field of electrical engineering.

Collaborations

Throughout his career, Wang has collaborated with notable colleagues, including Te-Sung Wu and Chung W Ho. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Tsing-Chow Wang's innovative spirit and dedication to semiconductor technology have resulted in numerous patents that enhance the efficiency and performance of electronic devices. His contributions continue to shape the future of the industry, making him a significant figure in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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