The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2004
Filed:
Jan. 02, 2003
Tsing-Chow Wang, Cupertino, CA (US);
Aptos Corporation, Milpitas, CA (US);
Abstract
A semiconductor die package design incorporating at least a pair of functional semiconductor dies. The input/output pads locations on one of the dies (the daughter die) are located at the near mirror image of the original die (mother die). The package architecture includes two dies back-to-back or stacked dies back-to-back, therefore a plurality of input/output interconnections can be formed. The package increases density and performance by twofold or more compared to a regular package containing only one die with the same footprint. At least one additional pin can be dedicated as the chip select pin for the daughter die or multiple dies. The other pins can be shared with the mother die.