Company Filing History:
Years Active: 2006-2007
Title: The Innovations of Chi Shen Ho
Introduction
Chi Shen Ho is a notable inventor based in Fremont, CA, who has made significant contributions to the field of semiconductor packaging. With a total of two patents to his name, he has demonstrated a commitment to advancing technology in this area. His work is characterized by innovative methods that enhance the efficiency and functionality of semiconductor devices.
Latest Patents
Chi Shen Ho's latest patents include a "Wafer level mounting frame for ball grid array packaging," which outlines a method of forming a semiconductor package. This method involves placing a semiconductor chip in cavities of a semiconductor chip carrier substrate. Another significant patent is the "Flexible multi-chip module and method of making the same." This invention features a semiconductor package that includes a flexible multichip module with multiple chips on flexible appendages, allowing for the chips to be arranged in aligned and stacked positions.
Career Highlights
Chi Shen Ho is currently employed at Aptos Corporation, where he continues to innovate and develop new technologies in semiconductor packaging. His work has been instrumental in improving the design and manufacturing processes of semiconductor devices, making them more efficient and reliable.
Collaborations
Throughout his career, Chi Shen Ho has collaborated with talented individuals such as Min Chih Hsuan and Chang-Ming Lin. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Chi Shen Ho's contributions to the field of semiconductor packaging through his innovative patents and collaborative efforts highlight his importance as an inventor. His work continues to influence the industry and pave the way for future advancements in technology.