The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
Mar. 31, 2004
Applicants:
Min Chih Hsuan, Hsinchu, TW;
Chi Shen Ho, Fremont, CA (US);
Chang-ming Lin, San Jose, CA (US);
Kuolung Lei, San Jose, CA (US);
Inventors:
Min Chih Hsuan, Hsinchu, TW;
Chi Shen Ho, Fremont, CA (US);
Chang-Ming Lin, San Jose, CA (US);
Kuolung Lei, San Jose, CA (US);
Assignee:
Aptos Corp, Milpitas, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package including a flexible multichip module having multiple chips on flexible appendages with the flexible appendages folded so that the semiconductor chips are arranged in aligned and stacked positions.