Company Filing History:
Years Active: 2006
Title: Kuo Lung Lei: Innovator in Copper Bump Technology
Introduction
Kuo Lung Lei is a notable inventor based in San Jose, California. He has made significant contributions to the field of semiconductor technology, particularly in the area of copper bump formation for flip chip bonding.
Latest Patents
Kuo Lung Lei holds a patent for a method titled "Method for forming copper bump antioxidation surface." This innovative method enhances oxidation resistance and thermal stability in copper bumps. The process involves providing a copper column with a thickness of at least about 40 microns, which overlays a metallurgy consisting of an uppermost copper metal layer and a lowermost titanium layer. The titanium layer is in contact with an exposed copper bonding pad portion that is surrounded by a passivation layer. Additionally, the method includes selectively depositing at least one protective metal layer over the copper column through an electrolytic deposition process.
Career Highlights
Kuo Lung Lei is currently associated with Aptos Corporation, where he applies his expertise in semiconductor technologies. His work focuses on improving the reliability and performance of electronic components through innovative methods.
Collaborations
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Conclusion
Kuo Lung Lei's contributions to the field of semiconductor technology, particularly through his patented method for forming copper bumps, highlight his role as an influential inventor. His work continues to impact the industry positively.