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Alchimer

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USPTO Granted Patents = 21

% Expired Patents = 19.0

CIPO Patents = 1

EPO Patents = 12

Forward Citations = 20

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17 inventors (with patents filed for the assignee):

Vincent Mevellec (8 out of 14 patents)

Dominique Suhr (8 out of 9 patents)

Christophe Bureau (5 out of 22 patents)

4. José Gonzalez (4 out of 6 patents)

5. Frédéric Raynal (4 out of 5 patents)

6. Jean Pinson (3 out of 11 patents)

7. Laurianne Religieux (2 out of 3 patents)

8. Jérôme Daviot (2 out of 2 patents)

9. Hervé Monchoix (2 out of 2 patents)

10. Paul Blondeau (1 out of 1 patent)

11. Said Zahraoui (1 out of 1 patent)

12. Francis Descours (1 out of 1 patent)

13. Saïd Zahraoui (1 out of 1 patent)

14. Isabelle Bispo (1 out of 1 patent)

15. Nathalie Thieriet (1 out of 1 patent)

21 patents: Sort by Forward Citations

1. 10472726 - Electrolyte and process for electroplating copper onto a barrier layer (2019-11-12),

2. 10460945 - Machine suitable for plating a cavity of a semi-conductive or conductive substrate such as a through via structure (2019-10-29),

3. 10011914 - Copper electrodeposition bath containing an electrochemically inert cation (2018-07-03),

4. 9564333 - Method for forming a metal silicide using a solution containing gold ions and fluorine ions (2017-02-07),

5. 9368397 - Method for forming a vertical electrical connection in a layered semiconductor structure (2016-06-14),

6. 9190283 - Method of depositing metallic layers based on nickel or cobalt on a semiconducting solid substrate; kit for application of said method (2015-11-17),

7. 9181623 - Solution and process for activating the surface of a semiconductor substrate (2015-11-10),

8. 9133560 - Electroplating composition for coating a substrate surface with a metal (2015-09-15),

9. 8883641 - Solution and method for activating the oxidized surface of a semiconductor substrate (2014-11-11),

10. 8795503 - Device and method to conduct an electrochemical reaction on a surface of a semi-conductor substrate (2014-08-05),

11. 8784635 - Formation of organic electro-grafted films on the surface of electrically conductive or semi-conductive surfaces (2014-07-22),

12. 8591715 - Electrodeposition composition and method for coating a semiconductor substrate using the said composition (2013-11-26),

13. 8574418 - Electroplating method for coating a substrate surface with a metal (2013-11-05),

14. 8524512 - Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method (2013-09-03),

15. 8405217 - Coating method and solutions for enhanced electromigration resistance (2013-03-26),

Company Overview

Alchimer is a technology company based in Massy, France, specializing in advanced deposition processes for the semiconductor and electronics industries. The company focuses on developing innovative solutions for electrochemical deposition, enabling high-precision manufacturing of electronic components. Alchimer's expertise lies in enhancing the performance and reliability of devices through its proprietary technologies, which cater to the evolving needs of the microelectronics sector, particularly in the context of miniaturization and increased functionality.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Nov 3 2026

21 Patents

#6 in Massy

#976 in France

#30,040 in the World

Alchimer

Forward Citations = 20

17 inventors:

Vincent Mevellec (8 out of 14 patents)

Dominique Suhr (8 out of 9 patents)

Christophe Bureau (5 out of 22 patents)

4. José Gonzalez (4 out of 6 patents)

5. Frédéric Raynal (4 out of 5 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Alchimer. Retrieved from https://idiyas.com/company/alchimer

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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