Vincent Mevellec

This inventor holds 14 USPTO granted patents and 3 published patent applications, plus 6 CIPO patents and 8 EPO patents, primarily in Electrochemical Processes. Top assignees: Alchimer, Commissariat a L'energie Atomique Et Aux Energies Alternatives, Aveni. Active years: 2012-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Vincent Mevellec. Retrieved from https://idiyas.com/inventor/vincent-mevellec

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 14 (Patent Applications = 3)

% Patents Active = 78.6

CIPO Patents = 6

EPO Patents = 8 (Patent Applications = 12)

Average Co-Inventor Count = 2.3

ph-index = 2

Forward Citations = 12(Granted Patents)

Location History:

Orsay, FR (2014 - 2017)
Chaville, FR (2013 - 2019)
Boulogne Billancourt, FR (2012 - 2022)

Company Filing History:

Commissariat a L'energie Atomique Et Aux Energies Alternatives

Years Active: 2012-2022

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Areas of Expertise:

Electrodeposition

Copper Patterns

Electroplating

Organic Film

Metal Silicide

Electrical Connection

Semiconductor Structure

Diffusion Barrier

Insulating Film

Metallization

Surface Activation

14 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11384445 - Process for electrodeposition of cobalt (2022-07-12),

2. 10883185 - Copper electrodeposition solution and process for high aspect ratio patterns (2021-01-05),

3. 10472726 - Electrolyte and process for electroplating copper onto a barrier layer (2019-11-12),

4. 9790371 - Method for preparing an organic film at the surface of a solid support under non-electrochemical conditions, solid support thus obtained and preparation kit (2017-10-17),

5. 9790370 - Method for preparing an organic film at the surface of a solid support under non-electrochemical conditions, solid support thus obtained and preparation kit (2017-10-17),

6. 9725602 - Method for preparing an organic film at the surface of a solid support under non-electrochemical conditions, solid support thus obtained and preparation kit (2017-08-08),

7. 9564333 - Method for forming a metal silicide using a solution containing gold ions and fluorine ions (2017-02-07),

8. 9368397 - Method for forming a vertical electrical connection in a layered semiconductor structure (2016-06-14),

9. 9190283 - Method of depositing metallic layers based on nickel or cobalt on a semiconducting solid substrate; kit for application of said method (2015-11-17),

10. 9181623 - Solution and process for activating the surface of a semiconductor substrate (2015-11-10),

11. 8883641 - Solution and method for activating the oxidized surface of a semiconductor substrate (2014-11-11),

12. 8709542 - Method for preparing an organic film at the surface of solid support under non-electrochemical conditions, solid support thus obtained and preparation kit (2014-04-29),

13. 8524512 - Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method (2013-09-03),

14. 8119542 - Method of preparing an electrically insulating film and application for the metallization of vias (2012-02-21),

Title: Vincent Mevellec: A Pioneer in Electrodeposition Innovation

Introduction

Vincent Mevellec is a prominent inventor based in Boulogne Billancourt, France. He has developed an impressive portfolio of 14 patents, showcasing his expertise and commitment to advancing technologies in the field of electrodeposition.

Latest Patents

One of Vincent's latest innovations is the patent for a "Process for Electrodeposition of Cobalt." This invention relates to the fabrication of cobalt interconnections through a unique electrolyte that maintains a pH below 4.0. The composition involves cobalt ions, chloride ions, and up to two organic additives of low molecular weight, which may include an alpha-hydroxy carboxylic acid or a compound with a pKa value ranging from 1.8 to 3.5.

Another significant contribution from Vincent is the patent titled "Copper Electrodeposition Solution and Process for High Aspect Ratio Patterns." This invention focuses on an electrolyte composition designed for depositing copper on conductive surfaces. The formulation combines 2,2'-bipyridine, imidazole, tetra-ethyl-ammonium, and a copper complexing agent. This advanced electrolyte facilitates the manufacture of small-size copper interconnects without voids, achieving a filling speed that aligns with industrial standards. The patent also describes a process for effectively filling cavities with copper, along with the resultant semiconductor device.

Career Highlights

Vincent Mevellec's career has been marked by his work at notable organizations such as Alchimer and the Commissariat à l'énergie Atomique et aux Énergies Alternatives. His experience in these companies has significantly contributed to his expertise in the field of electrodeposition and semiconductor technologies.

Collaborations

Throughout his career, Vincent has had the privilege of collaborating with talented individuals, including his coworkers Dominique Suhr and Sébastien Roussel. These collaborations have fostered an environment of innovation, allowing for the development of cutting-edge solutions in electrodeposition.

Conclusion

Vincent Mevellec's contributions to the field of electrodeposition demonstrate his commitment to innovation and excellence. With a significant number of patents to his name and a proven track record of collaboration, he continues to influence the industry positively through his groundbreaking inventions.

Profile summary based on public USPTO records.