The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2021
Filed:
Dec. 26, 2017
Applicant:
Aveni, Massy, FR;
Inventors:
Laurianne Religieux, Paris, FR;
Vincent Mevellec, Boulogne-Billancourt, FR;
Mikailou Thiam, Compiegne, FR;
Assignee:
aveni, Massy, FR;
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); C25D 7/12 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01); C25D 7/123 (2013.01); H01L 21/76877 (2013.01);
Abstract
The present invention relates to an electrolyte composition for depositing copper on a conductive surface. The composition contains a combination of 2,2'-bipyridine, imidazole, tetra-ethyl-ammonium, and a complexing agent for copper. This electrolyte makes it possible to manufacture small size copper interconnects without any void and with a filling speed that is compatible with industrial constrain. The invention also concerns a process for filling cavities with copper, and a semiconductor device that is obtained according to this process.