Location History:
- Chatenay Malabry, FR (2018)
- Paris, FR (2019 - 2021)
Company Filing History:
Years Active: 2018-2021
Title: Laurianne Religieux: Innovator in Copper Electrodeposition Technologies
Introduction
Laurianne Religieux is a prominent inventor based in Paris, France. She has made significant contributions to the field of semiconductor technology, particularly in the area of copper electrodeposition. With a total of three patents to her name, her work focuses on improving the efficiency and effectiveness of copper deposition processes.
Latest Patents
One of Laurianne's latest patents is titled "Copper electrodeposition solution and process for high aspect ratio patterns." This invention relates to an electrolyte composition designed for depositing copper on conductive surfaces. The composition includes a combination of 2,2'-bipyridine, imidazole, tetra-ethyl-ammonium, and a complexing agent for copper. This innovative electrolyte allows for the manufacturing of small-sized copper interconnects without voids, achieving a filling speed compatible with industrial constraints. Additionally, she has developed a patent for an "Electrolyte and process for electroplating copper onto a barrier layer." This invention features an electrolyte composition for depositing copper on semiconductor substrates that are covered with a barrier layer. The combination of imidazole and 2,2'-bipyridine serves as a suppressor, while thiodiglycolic acid acts as an accelerator, enabling bottom-up filling in trenches of very small width, typically less than 100 nm.
Career Highlights
Throughout her career, Laurianne has worked with notable companies such as Alchimer and Aveni. Her expertise in copper electrodeposition has positioned her as a key player in the semiconductor industry.
Collaborations
Laurianne has collaborated with esteemed colleagues, including Vincent Mevellec and Dominique Suhr. Their combined efforts have contributed to advancements in the field of semiconductor technology.
Conclusion
Laurianne Religieux is a trailblazer in the realm of copper electrodeposition, with her innovative patents paving the way for advancements in semiconductor manufacturing. Her contributions continue to influence the industry and inspire future innovations.