The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2013
Filed:
Sep. 20, 2006
Hervé Monchoix, Saint Isnier, FR;
Frédéric Raynal, Paris, FR;
Jérôme Daviot, Leuven, BE;
José Gonzalez, Paris, FR;
Hervé Monchoix, Saint Isnier, FR;
Frédéric Raynal, Paris, FR;
Jérôme Daviot, Leuven, BE;
José Gonzalez, Paris, FR;
Alchimer, Massy, FR;
Abstract
The object of the present invention is a method of coating a surface of a substrate with copper by electroplating. According to the invention, this method comprises: a step during which the surface to be coated is brought into contact with an electroplating bath while the surface is not under electrical bias; a step of forming the coating during which the surface is biased; a step during which the surface is separated from the electroplating bath while it is under electrical bias; the aforementioned electroplating bath comprising, in solution in a solvent: a source of copper ions, with a concentration of between 0.4 and 40mM; and at least one copper complexing agent.