The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2016
Filed:
Nov. 01, 2013
Tokyo Electron Limited, Minato-ku, JP;
Akira Koshiishi, Nirasaki, JP;
Masaru Sugimoto, Nirasaki, JP;
Kunihiko Hinata, Nirasaka, JP;
Noriyuki Kobayashi, Nirasaki, JP;
Chishio Koshimizu, Nirasaki, JP;
Ryuji Ohtani, Nirasaki, JP;
Kazuo Kibi, Nirasaki, JP;
Masashi Saito, Nirasaki, JP;
Naoki Matsumoto, Nirasaki, JP;
Yoshinobu Ohya, Nirasaki, JP;
Manabu Iwata, Nirasaki, JP;
Daisuke Yano, Minami-Alps, JP;
Yohei Yamazawa, Nirasaki, JP;
Hidetoshi Hanaoka, Nirasaki, JP;
Toshihiro Hayami, Nirasaki, JP;
Hiroki Yamazaki, Nirasaki, JP;
Manabu Sato, Nirasaki, JP;
TOKYO ELECTRON LIMITED, Minato-ku, JP;
Abstract
A plasma processing apparatus includes a first and second electrodes disposed on upper and lower sides and opposite each other within a process container, a first RF power application unit and a DC power supply both connected to the first electrode, and second and third radio frequency power application units both connected to the second electrode. A conductive member is disposed within the process container and grounded to release through plasma a current caused by a DC voltage applied from the DC power supply. The conductive member is supported by a first shield part around the second electrode and laterally protruding therefrom at a position between the mount face of the second electrode and an exhaust plate for the conductive member to be exposed to the plasma. The conductive member is grounded through a conductive internal body of the first shield part.