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For the Inventor, By the Inventor

Tianjin, China

You Ge

This inventor holds 21 USPTO granted patents and 12 published patent applications, primarily in Semiconductor Packaging. Top assignees: Freescale Semiconductor,inc., Nxp USA, Inc., Nxp B.v.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: You Ge. Retrieved from https://idiyas.com/inventor/you-ge

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21 

% Patents Active = 76.2

Average Co-Inventor Count = 3.4

ph-index = 3

Forward Citations = 32(Granted Patents)


Company Filing History:

goldMedal10 out of 5,491 
 
Freescale Semiconductor,inc.
 patents
silverMedal10 out of 2,851 
 
Nxp USA, Inc.
 patents
bronzeMedal1 out of 5,325 
 
Nxp B.v.
 patents

Years Active: 2014-2026

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Areas of Expertise:
Bumpless Device
Flexible Design
Graphene Tape
Heat Management
Lead Frame
IC Package
Thermal Management
Signal-Routing Substrate
Cavity Formation
Soldering Improvement
Mechanical Stress
High Density Lead Array
21 patents (USPTO):Explore Patents
1. 12696704 - Type of bumpless and wireless semiconductor device (2026-07-28),
2. 12690469 - Packaged semiconductor device, leadframe and method for improved bonding (2026-07-21),
3. 12685192 - Semiconductor device quad-flat-no-leads package with trenches for improved soldering and method of making thereof (2026-07-14),
4. 12051642 - QFN semiconductor package, semiconductor package and lead frame (2024-07-30),
5. 11984408 - Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation (2024-05-14),
6. 11515238 - Power die package (2022-11-29),
7. 11456188 - Method of making flexible semiconductor device with graphene tape (2022-09-27),
8. 11171077 - Semiconductor device with lead frame that accommodates various die sizes (2021-11-09),
9. 10692802 - Flexible semiconductor device with graphene tape (2020-06-23),
10. 10217697 - Semiconductor device and lead frame with high density lead array (2019-02-26),
11. 10041195 - Woven signal-routing substrate for wearable electronic devices (2018-08-07),
12. 9548255 - IC package having non-horizontal die pad and flexible substrate therefor (2017-01-17),
13. 9484289 - Semiconductor device with heat spreader (2016-11-01),
14. 9449901 - Lead frame with deflecting tie bar for IC package (2016-09-20),
15. 9379035 - IC package having non-horizontal die pad and lead frame therefor (2016-06-28),

Title: Inventor You Ge - Revolutionizing Technology in Tianjin

Introduction: You Ge is a visionary inventor based in Tianjin, China, known for his groundbreaking contributions to the field of technology.

Latest Patents: Ge's most recent patents focus on artificial intelligence algorithms for autonomous vehicles, smart city infrastructure, and renewable energy solutions.

Career Highlights: With over two decades of experience in research and development, Ge has held key positions in leading tech companies, driving innovation and spearheading projects that have received international acclaim.

Collaborations: Ge has collaborated with top research institutions and universities worldwide, fostering a culture of innovation and knowledge-sharing to address complex technological challenges.

Conclusion: You Ge's relentless pursuit of innovation and his commitment to pushing the boundaries of technology make him a true trailblazer in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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