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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9548255 B1

PDFFull Text
Date of Patent:
Jan. 17, 2017

Filed:

Apr. 27, 2016

Ic package having non-horizontal die pad and flexible substrate therefor

Applicant:

Freescale Semiconductor, Inc., Austin, TX (US);

Inventors:

You Ge, Tianjin, CN;

Meng Kong Lye, Shah Alam, MY;

Zhijie Wang, Tinajin, CN;

Assignee:

FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);

Attorney:

Charles E. Bergere

Primary Examiner:

Tu-Tu Ho

Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/16 (2006.01); H01L 25/065 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 21/48 (2006.01); H01L 21/54 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3672 (2013.01); H01L 21/4853 (2013.01); H01L 21/4882 (2013.01); H01L 21/54 (2013.01); H01L 21/565 (2013.01); H01L 23/16 (2013.01); H01L 23/3114 (2013.01); H01L 23/4985 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01);
Abstract

An integrated circuit (IC) package has a base, side walls mechanically connected to the base, IC dies respectively mounted on inner surfaces of the side walls or the base, and electrical connections connecting a corresponding IC die to another component of the IC package. In one embodiment, each die is electrically connected to only bond pads on its corresponding side wall or base. Each such side wall and the base have routing structures (e.g., copper traces) that connect each bond pad to another component of the IC package. The IC package is assembled using a flexible substrate that has side regions that rotate relative to the base such that the routing structures do not break. By connecting an IC die only to bond pads on its corresponding side wall or base with bond wires, the bond wires will not break during side-wall rotation.

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