Freescale Semiconductor,inc.

Nxp USA, Inc.

Nxp B.v.

You Ge

Meng Kong Lye

Zhijie Wang

Penglin Mei

Zhigang Bai

Kai Yun Yow

Poh Leng Eu

Xuesong Xu

Kabir J Mirpuri

Mariano Layson Ching, Jr

Shunan Qiu

Yit Meng Lee

Beiyue Yan

A Quad Flat No-Lead (QFN) package comprises a semiconductor die, a lead frame and molding compound. The lead frame comprises a die pad having a substantially rectangular inner part and a plurality of protrusions around the periphery thereof and contiguous therewith and extending outwardly therefrom, and a plurality of leads around the four sides of the die-pad. The molding compound encapsulates the semiconductor die and forming the package. The molding compound has a respective moat therein between each side of the die pad and a respective set of leads. The die pad has a plurality of trenches extending from the second surface of the die pad towards the first surface at least in the inner part of the die pad. The plurality of the trenches each extend across a protrusion to the moat.

QFN semiconductor package, semiconductor package and lead frame

A semiconductor package comprises a lead frame, a die pad, bond pads, and leads. A die may be arranged on the die pad, the die comprising an integrated circuit. In an example, the die and at least a portion of the lead frame are encapsulated with a molding compound (MC). A first thickness of the MC over a first portion of the die is less than a second thickness over a second portion of the die to form a cavity in the MC and the MC directly contacts the first portion and the second portion of the die.

Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation

A power die package includes a lead frame having a flag with power leads on one lateral side and signal leads on one or more other lateral sides. A power die is attached to a bottom surface of the flag and electrically connected to the power leads with a conductive epoxy. A control die is attached to a top surface of the flag and electrically connected to the signal leads with bond wires. A mold compound is provided that encapsulates the dies, the bond wires, and proximal parts of the leads, while distal ends of the leads are exposed, forming a PQFN package.

Power die package

A flexible semiconductor device includes a first tape having bonding pads and conductive traces formed. A semiconductor die having a bottom surface is attached to the first tape and electrically connected to the bond pads by way of electrical contacts. A second tape is attached to a top surface of the semiconductor die. The first and second tapes encapsulate the semiconductor die, the electrical contacts, and at least a part of the conductive traces.

Method of making flexible semiconductor device with graphene tape

A semiconductor device is assembled using a lead frame having leads that surround a central opening. The leads have proximal ends near to the central opening and distal ends spaced from the central opening. A heat sink is attached to a bottom surface of the leads and a semiconductor die is attached to a top surface of the leads, where the die is supported on the proximal ends of the leads and spans the central opening. Bond wires electrically connect electrodes on an active surface of the die and the leads. An encapsulant covers the bond wires and at least the top surface of the leads and the die. The distal ends of the leads are exposed to allow external electrical communication with the die.

Semiconductor device with lead frame that accommodates various die sizes

Flexible semiconductor device with graphene tape

A semiconductor device includes a lead frame having leads arranged in an array that has columns extending in a first direction and rows extending in a second direction. Each lead includes a bond pad portion and a solder pad portion down-set from the bond pad portion. The solder pad portion horizontally extends from the bond pad portion in the first direction. A semiconductor die is mounted on a set of the plurality of leads and electrically connected to the bond pad portion of at least one of the plurality of leads. The semiconductor die, and the plurality of leads are encapsulated by a molding material, wherein the molding material defines a package body, and the solder pad portion of each lead is exposed at a back side of the package body.

Semiconductor device and lead frame with high density lead array

A woven signal-routing substrate for a wearable electronic device has conductive warps and wefts that are woven with each other and with insulative warps and wefts. Woven electrical cross-connections are formed at some of the intersections of the conductive warps and wefts, while no electrical cross-connections are formed at other intersections, to provide a signal-routing architecture for the substrate that can be used to route signals between electronic components of the wearable device. Non-connecting intersections are formed using insulative warps that are sufficiently thicker than the relatively thin conductive warps to enable a conductive weft to cross a conductive warp without making physical contact at intersection locations where an electrical cross-connection is not desired. The woven electrical cross-connections may be formed at other intersection locations using weaving topologies that ensure that the corresponding mutually orthogonal warps and wefts do contact one another.

Woven signal-routing substrate for wearable electronic devices

An integrated circuit (IC) package has a base, side walls mechanically connected to the base, IC dies respectively mounted on inner surfaces of the side walls or the base, and electrical connections connecting a corresponding IC die to another component of the IC package. In one embodiment, each die is electrically connected to only bond pads on its corresponding side wall or base. Each such side wall and the base have routing structures (e.g., copper traces) that connect each bond pad to another component of the IC package. The IC package is assembled using a flexible substrate that has side regions that rotate relative to the base such that the routing structures do not break. By connecting an IC die only to bond pads on its corresponding side wall or base with bond wires, the bond wires will not break during side-wall rotation.

IC package having non-horizontal die pad and flexible substrate therefor

A semiconductor device includes a package body, a semiconductor die embedded in the package body and a heat spreader attached to a top surface of the package body and spaced from semiconductor die. The heat spreader may be formed of solder that is melted within a recess in the top surface of the package body.

Semiconductor device with heat spreader

A packaged integrated circuit (IC) device having a heatsink mounted onto an IC die, itself mounted onto a die pad, is assembled using a lead frame having tie bars that deflect during an encapsulation phase of the device assembly, which enables the die pad, the die, and the heatsink to move relative to the lead frame support structure when compressive force is applied by the molding tool. This movement results in negligible relative displacement between the heatsink and the die during encapsulation, which reduces the probability of physical damage to the die. Each tie bar has a number of differently angled sections that enable it to deflect when compressive force is applied to it.

Lead frame with deflecting tie bar for IC package

A multi-component integrated circuit (IC) package has a base component (e.g., an interposer) defining a base of the IC package, a plurality of die pads extending from the base and forming side walls of the IC package, one or more IC dies, each mounted on an interior surface of one of the die pads, and bond wires electrically connecting the IC dies to another component of the IC package, such as the interposer or another die. By mounting dies on non-horizontal side walls, the IC package can provide more-effective thermal dissipation than conventional 3D IC packages having stacks of IC dies.

IC package having non-horizontal die pad and lead frame therefor

A packaged semiconductor device has a top and a bottom and includes a lead frame, a die, and an encapsulant that encapsulates the die and most of the lead frame. The lead frame includes a die pad on which the die is mounted, leads electrically connected to the die such as with bond wires, and die pad extensions that fan out from the die pad. Each die-pad extension has a proximal segment and a distal segment. The distal segments are interleaved with the leads. The bottoms of the die pad and the proximal segments of the extensions may be exposed at the bottom of the device. The top of the device may have notches corresponding to the extensions and portions of the distal segments may be exposed and bent into corresponding ones of the notches at the top of the device.

Semiconductor device with heat-dissipating lead frame

A semiconductor device has a die mounted on a die paddle that is elevated above and thermally connected via tie bars to a heat sink structure. Heat generated by the die flows from the die to the die paddle to the tie bars to the heat sink structure and then to either the external environment or to an external heat sink. By elevating the die/paddle sub-assembly above the heat sink structure, the packaged device is less susceptible to delamination between the die and die attach adhesive and/or the die attach adhesive and the die paddle. An optional heat sink ring can surround the die paddle.

Semiconductor package with stress relief and heat spreader

A packaged semiconductor device having an integrated circuit (IC) die, a flexible tube, and a metal slug. During assembly, a first end of the tube is mounted on a surface of the IC die and a second end of the tube extends away from the die surface. The exposed portions of the surface of the IC die are encased in a molding compound, which also encases the perimeter of the tube. After molding, the tube may be filled with metal to improve conduction of heat away from the die top. If the tube is formed of a soft material like rubber then the tube will not damage the die top during attachment thereto.

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Tianjin, China

You Ge