The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2020
Filed:
Nov. 30, 2016
Applicant:
Nxp Usa, Inc., Austin, TX (US);
Inventors:
Assignee:
NXP USA, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49572 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/3672 (2013.01); H01L 23/3736 (2013.01); H01L 23/4985 (2013.01); H01L 23/49579 (2013.01); H01L 23/562 (2013.01); H01L 23/13 (2013.01); H01L 23/36 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29099 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83856 (2013.01); H01L 2924/0781 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/15162 (2013.01); H01L 2924/15173 (2013.01);
Abstract
A flexible semiconductor device includes a first tape having bonding pads and conductive traces formed. A semiconductor die having a bottom surface is attached to the first tape and electrically connected to the bond pads by way of electrical contacts. A second tape is attached to a top surface of the semiconductor die. The first and second tapes encapsulate the semiconductor die, the electrical contacts, and at least a part of the conductive traces.