The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2024
Filed:
Jul. 28, 2021
Nxp Usa, Inc., Austin, TX (US);
NXP USA, Inc., Austin, TX (US);
Abstract
A Quad Flat No-Lead (QFN) package comprises a semiconductor die, a lead frame and molding compound. The lead frame comprises a die pad having a substantially rectangular inner part and a plurality of protrusions around the periphery thereof and contiguous therewith and extending outwardly therefrom, and a plurality of leads around the four sides of the die-pad. The molding compound encapsulates the semiconductor die and forming the package. The molding compound has a respective moat therein between each side of the die pad and a respective set of leads. The die pad has a plurality of trenches extending from the second surface of the die pad towards the first surface at least in the inner part of the die pad. The plurality of the trenches each extend across a protrusion to the moat.