The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Sep. 14, 2022
Applicant:

Nxp Usa, Inc., Austin, TX (US);

Inventors:

You Ge, Tianjin, CN;

Zhijie Wang, Tianjin, CN;

Yit Meng Lee, Kuala Lumpur, MY;

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 54/00 (2026.01); H10W 42/00 (2026.01); H10W 46/00 (2026.01); H10W 72/90 (2026.01);
U.S. Cl.
CPC ...
H10P 54/00 (2026.01); H10W 42/00 (2026.01); H10W 42/121 (2026.01); H10W 46/00 (2026.01); H10W 46/503 (2026.01); H10W 72/936 (2026.01); H10W 72/9445 (2026.01); H10W 72/965 (2026.01); H10W 72/967 (2026.01);
Abstract

According to a first aspect of the present invention there is provided a semiconductor device comprising: a die having a central active region, a top surface, a bottom surface, and sidewalls having a plurality of perforations therein, each perforation extending from a top end at the top surface to a bottom end at the bottom surface; a plurality of die pads on the top surface and extending from the central active region to respective top ends; a patterned back-side-metallization layer on the bottom surface, comprising a plurality of electrically isolated regions extending to respective bottom ends; metal coating partially filling the perforations and providing electrical connection between respective ones of the plurality of die pads and respective ones of the plurality of electrically isolated regions; and a passivation layer covering the top surface and the die pads.


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