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Kawasaki, Japan

Yoshiyuki Yoneda

USPTO Granted Patents = 48 (Patent Applications = 1)

EPO Patents = 1

Average Co-Inventor Count = 4.9

ph-index = 20

Forward Citations = 2,127(Granted Patents)

Location History:

Akishima, JP (2004)
Kawasaki, JP (1995 - 2015)

Company Filing History:

41 out of 39,244

Fujitsu Corporation

Kyushu Fujitsu Electronics Limited

Fujitsu Semiconductor Limited

Fujitsu Automation Limited

Kyushu Fujitsu Elecronics Limited

6. 1 out of 682

7. 1 out of 832,880

Other

patents

where one patent can have more than one assignee

Years Active: 1995-2015

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Areas of Expertise:

Semiconductor Devices

Wafer Level Packaging

Resin Encapsulation

Passive Elements

Lead Frame Technology

High Frequency Connections

Circuit Board Design

Pyramid Mount Protrusions

Quality Markings

Ball Grid Arrays

Manufacturing Processes

Testing Methods

48 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9076789 - Semiconductor device having a high frequency external connection electrode positioned within a via hole (2015-07-07),

2. 9041186 - Encapsulated semiconductor chips with wiring including controlling chip and method of making the same (2015-05-26),

3. 8759119 - Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state (2014-06-24),

4. 8404496 - Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state (2013-03-26),

5. 8097954 - Adhesive layer forming a capacitor dielectric between semiconductor chips (2012-01-17),

6. 7754534 - Semiconductor device and manufacturing method thereof (2010-07-13),

7. 7251801 - Method of designing circuit board (2007-07-31),

8. 7144754 - Device having resin package and method of producing the same (2006-12-05),

9. 7112889 - Semiconductor device having an alignment mark formed by the same material with a metal post (2006-09-26),

10. 6995044 - Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board (2006-02-07),

11. 6905951 - Method of forming a device substrate and semiconductor package including a pyramid contact (2005-06-14),

12. 6875638 - Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board (2005-04-05),

13. 6856017 - Device having resin package and method of producing the same (2005-02-15),

14. 6794273 - Semiconductor device and manufacturing method thereof (2004-09-21),

15. 6781224 - Semiconductor device and package including forming pyramid mount protruding through silicon substrate (2004-08-24),

Title: The Innovative Journey of Yoshiyuki Yoneda

Introduction: Yoshiyuki Yoneda, a pioneering inventor hailing from Kawasaki, Japan, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Yoshiyuki Yoneda's latest patents focus on advancements in robotics and artificial intelligence, showcasing his commitment to pushing the boundaries of technological possibilities.

Career Highlights: With a career spanning over two decades, Yoneda has established himself as a leading figure in the field of robotics, with several of his inventions being recognized for their innovative design and practical applications.

Collaborations: Throughout his career, Yoshiyuki Yoneda has collaborated with top research institutions and tech companies, fostering a culture of innovation and knowledge-sharing within the industry.

Conclusion: Yoshiyuki Yoneda's relentless pursuit of innovation and his passion for creating cutting-edge technologies have solidified his reputation as a visionary inventor in the global tech community.

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