The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2005

Filed:

Jun. 08, 2004
Applicants:

Yoshiyuki Yoneda, Kawasaki, JP;

Masaharu Minamizawa, Kawasaki, JP;

Eiji Watanabe, Kawasaki, JP;

Mitsutaka Sato, Kawasaki, JP;

Inventors:

Yoshiyuki Yoneda, Kawasaki, JP;

Masaharu Minamizawa, Kawasaki, JP;

Eiji Watanabe, Kawasaki, JP;

Mitsutaka Sato, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/44 ; H01L021/302 ; H01L021/461 ;
U.S. Cl.
CPC ...
Abstract

A semiconductor device substrate has fine terminals with a small pitch and is able to be easily produced at a low cost without using a special process. A mounting terminal has a pyramidal shape and extending between a front surface and a back surface of a silicon substrate. An end of the mounting terminal protrudes from the back surface of the silicon substrate. A wiring layer is formed on the front surface of the silicon substrate. The wiring layer includes a conductive layer that is electrically connected to the mounting terminal.


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