The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

Mar. 22, 2013
Applicant:

Fujitsu Semiconductor Limited, Yokohama-shi, Kanagawa, JP;

Inventors:

Ryuji Nomoto, Kawasaki, JP;

Yoshiyuki Yoneda, Kawasaki, JP;

Koichi Nakamura, Fuchu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/02 (2006.01); H01L 29/20 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 25/16 (2006.01); H01L 25/00 (2006.01); H01L 23/31 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/02 (2013.01); H01L 29/2003 (2013.01); H01L 21/56 (2013.01); H01L 23/3128 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 24/97 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/10253 (2013.01); H01L 23/3107 (2013.01); H01L 23/49551 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/45144 (2013.01); H01L 2924/13064 (2013.01); H01L 23/13 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 2924/30107 (2013.01); H01L 23/49816 (2013.01); H01L 2924/1306 (2013.01);
Abstract

Disclosed is a semiconductor device including first and second semiconductor elements, first and second external connection terminals and a sealing member. The first external connection terminal is provided at a first surface of the first semiconductor element. The second semiconductor element is provided at a second surface side, that is at a side opposite to the first surface, of the first semiconductor element. The second external connection terminal is connected to the second semiconductor element, and the second external connection terminal is configured to be, together with the first external connection terminal, connected to a wiring board. The sealing member seals the first and second semiconductor elements and exposes a portion, that is configured to be connected to the wiring board, of the first external connection terminal and a portion, that is configured to be connected to the wiring board, of the second external connection terminal.


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