The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Feb. 26, 2013
Fujitsu Semiconductor Limited, Kanagawa, JP;
Shigeyuki Maruyama, Kawasaki, JP;
Yasuyuki Itoh, Kawasaki, JP;
Tetsurou Honda, Kawasaki, JP;
Kazuhiro Tashiro, Kawasaki, JP;
Makoto Haseyama, Kawasaki, JP;
Kenichi Nagashige, Kawasaki, JP;
Yoshiyuki Yoneda, Kawasaki, JP;
Hirohisa Matsuki, Kawasaki, JP;
Fujitsu Semiconductor Limited, Yokohama, JP;
Abstract
A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.