The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2005
Filed:
Mar. 19, 2002
Yoshiyuki Yoneda, Kawasaki, JP;
Masaharu Minamizawa, Kawasaki, JP;
Nobutaka Shimizu, Kawasaki, JP;
Kazuyuki Imamura, Kawasaki, JP;
Atsushi Kikuchi, Kawasaki, JP;
Masaru Nukiwa, Kawasaki, JP;
Osamu Yamaguchi, Kawasaki, JP;
Yasunori Fujimoto, Kawasaki, JP;
Takumi Ihara, Kawasaki, JP;
Muneharu Morioka, Kawasaki, JP;
Yukihiro Kuriki, Kawasaki, JP;
Masaki Uchida, Kawasaki, JP;
Yoshiyuki Yoneda, Kawasaki, JP;
Masaharu Minamizawa, Kawasaki, JP;
Nobutaka Shimizu, Kawasaki, JP;
Kazuyuki Imamura, Kawasaki, JP;
Atsushi Kikuchi, Kawasaki, JP;
Masaru Nukiwa, Kawasaki, JP;
Osamu Yamaguchi, Kawasaki, JP;
Yasunori Fujimoto, Kawasaki, JP;
Takumi Ihara, Kawasaki, JP;
Muneharu Morioka, Kawasaki, JP;
Yukihiro Kuriki, Kawasaki, JP;
Masaki Uchida, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A manufacturing method of a semiconductor device incorporating a passive element includes the steps as follows: a redistribution board forming step forms a redistribution board incorporating the passive element on a base board; a semiconductor element mounting step mounts at least one semiconductor element formed on an opposite side surface of the redistribution board with regard to the base board; a base board separating step separates the base board from the redistribution board and exposes the other surface of the redistribution board; a redistribution board mounting step mounts the redistribution board on a package board via electrode pads exposed from the other surface of the redistribution board.