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For the Inventor, By the Inventor

Nagano, Japan

Yasuyoshi Horikawa

This inventor holds 29 USPTO granted patents and 1 EPO patent, primarily in Wiring Substrate Technology. Top assignees: Shinko Electric Industries Co., Ltd., Tokyo Coil Engineering Co., Ltd.. Active years: 2004-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasuyoshi Horikawa. Retrieved from https://idiyas.com/inventor/yasuyoshi-horikawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29

% Patents Active = 93.1

 

Average Co-Inventor Count = 2.4

ph-index = 7

Forward Citations = 172(Granted Patents)


Company Filing History:

goldMedal29 out of 1,704 
 
Shinko Electric Industries Co., Ltd.
 patents
silverMedal2 out of 2 
 
Tokyo Coil Engineering Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2004-2022

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Areas of Expertise:
Inductor
Wiring Substrate
Semiconductor Packaging
Optical Sensor
Capacitor
Electronic Package
Integrated Circuit
Manufacturing Method
Electronic Parts
Stacked Devices
Connecting Terminal
Substrate
29 patents (USPTO):Explore Patents
1. 11437174 - Inductor and method of manufacturing same (2022-09-06),
2. 11309224 - Folded substrate for stacked integrated circuit devices (2022-04-19),
3. 10395810 - Inductor (2019-08-27),
4. 10115878 - Optical sensor (2018-10-30),
5. 10062490 - Method of manufacturing an inductor (2018-08-28),
6. 9721884 - Inductor device and method of manufacturing the same (2017-08-01),
7. 9603253 - Wiring substrate, manufacturing method therefor, and semiconductor package (2017-03-21),
8. 9590154 - Wiring substrate and light emitting device (2017-03-07),
9. 9324929 - Wiring substrate (2016-04-26),
10. 9282629 - Wiring substrate and semiconductor package (2016-03-08),
11. 9159648 - Wiring substrate and manufacturing method thereof (2015-10-13),
12. 9084372 - Wiring substrate, light emitting device, and manufacturing method of wiring substrate (2015-07-14),
13. 9006894 - Wiring board and light emitting device (2015-04-14),
14. 8770987 - Connecting terminal structure, manufacturing method of the same and socket (2014-07-08),
15. 8708711 - Connecting terminal structure, socket and electronic package (2014-04-29),

Title: Yasuyoshi Horikawa: Pioneering Inventor from Nagano

Introduction: Yasuyoshi Horikawa is a renowned inventor hailing from Nagano, Japan, known for his groundbreaking contributions to various technological fields.

Latest Patents: Horikawa holds several patents in the areas of robotics, artificial intelligence, and renewable energy, showcasing his innovative spirit and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Horikawa has worked with leading tech companies in Japan, spearheading projects that have revolutionized industries and improved efficiency in manufacturing processes.

Collaborations: Throughout his career, Horikawa has collaborated with top researchers and engineers from around the world, fostering a culture of innovation and knowledge-sharing in the tech community.

Conclusion: Yasuyoshi Horikawa's dedication to pushing the boundaries of technology and his passion for creating solutions to complex problems make him a true pioneer in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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