The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Aug. 14, 2014
Applicant:
Shinko Electric Industries Co., Ltd., Nagano-ken, JP;
Inventor:
Yasuyoshi Horikawa, Nagano, JP;
Assignee:
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano-ken, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 33/62 (2010.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 25/16 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/62 (2013.01); H05K 1/187 (2013.01); H05K 1/188 (2013.01); H01L 25/167 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/19107 (2013.01); H05K 1/0274 (2013.01); H05K 1/056 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10174 (2013.01); H05K 2201/10636 (2013.01); Y02P 70/611 (2015.11);
Abstract
A wiring substrate includes an insulation layer, separated wires formed on a first surface of the insulation layer, a first plating layer formed on a first surface of each of the wires, a reflection layer including a first opening that exposes at least a portion of the first plating layer as a connection pad, and an electronic component mounted on a second surface of each of the wires, which is located on an opposite side of the first surface of each of the wires. The electronic component is embedded in the insulation layer.