The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2018

Filed:

Jun. 05, 2017
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-Ken, JP;

Inventor:

Yasuyoshi Horikawa, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/20 (2010.01); H01L 33/36 (2010.01); H01L 33/56 (2010.01); A61B 5/024 (2006.01); A61B 5/1455 (2006.01); A61B 5/02 (2006.01); A61B 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); A61B 5/02416 (2013.01); A61B 5/14552 (2013.01); H01L 33/20 (2013.01); H01L 33/36 (2013.01); H01L 33/56 (2013.01); A61B 5/02 (2013.01); A61B 5/02427 (2013.01); A61B 5/6801 (2013.01); A61B 2562/046 (2013.01); A61B 2562/12 (2013.01); H01L 2224/42 (2013.01); H01L 2224/48091 (2013.01);
Abstract

An optical sensor includes a flexible substrate, a light emitting element, and a light receiving element. The light emitting element and the light receiving element are mounted on element mounting portions and connected to element connection portions by wires. The optical sensor also includes through wirings extending through the substrate. Each through wiring is bonded to the element mounting portion or the element connection portion. The through wirings include a heat radiation through wiring that is located immediately below the light emitting element and bonded to the element mounting portion on which the light emitting element is mounted. The optical sensor further includes light shielding materials and encapsulation resins for surrounding and encapsulating the light emitting element and the light receiving element, respectively.


Find Patent Forward Citations

Loading…