The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2015

Filed:

Jan. 24, 2013
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventors:

Shigetsugu Muramatsu, Nagano, JP;

Hiroshi Shimizu, Nagano, JP;

Yasuyoshi Horikawa, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-shi, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); F21V 7/00 (2006.01); C25D 5/02 (2006.01); H05K 7/20 (2006.01); H05K 3/46 (2006.01); F21K 99/00 (2010.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); F21K 9/90 (2013.01); F21V 7/00 (2013.01); H05K 1/0274 (2013.01); H05K 1/056 (2013.01); H05K 3/46 (2013.01); H01L 2224/16225 (2013.01); H05K 3/3452 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/099 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2054 (2013.01);
Abstract

There is provided a wiring substrate. The wiring substrate includes: a heat sink; an insulating layer on the heat sink; first and second wiring patterns on the insulating layer to be separated from each other at a certain interval; a first reflective layer including a first opening on the insulating layer so as to cover the first and second wiring patterns, wherein a portion of the first and second wiring patterns is exposed from the first opening, and wherein the portion of the first and second wiring patterns is defined as a mounting region on which a light emitting element is to be mounted; and a second reflective layer on the insulating layer, wherein the second reflective layer is interposed between the first and second wiring patterns. A thickness of the second reflective layer is smaller than that of the first reflective layer.


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