The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2017
Filed:
Jan. 07, 2015
Shinko Electric Industries Co., Ltd., Nagano, JP;
Tatsuaki Denda, Nagano, JP;
Toshio Kobayashi, Nagano, JP;
Yasuyoshi Horikawa, Nagano, JP;
Hiroshi Shimizu, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
A wiring substrate includes a heat radiation plate and a substrate provided on the heat radiation plate interposed by an adhesive layer. The substrate includes a first surface on which the adhesive layer is provided and a second surface on an opposite side of the first surface. The wiring substrate also includes a wiring provided on the second surface of the substrate, and a notch part that penetrates the substrate in a thickness direction of the substrate, with the notch part being formed by notching the wiring substrate inward from an outer edge part of the substrate from a plan view. The adhesive layer covers an end surface of the substrate that is exposed in an inner wall surface of the notch part.