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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9159648 B1

PDFFull Text
Date of Patent:
Oct. 13, 2015

Filed:

Jul. 11, 2013

Wiring substrate and manufacturing method thereof

Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventors:

Naoyuki Koizumi, Nagano, JP;

Jun Furuichi, Nagano, JP;

Yasuyoshi Horikawa, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-Shi, JP;

Attorney:

Rankin, Hill & Clark LLP

Primary Examiner:

Lex Malsawma

Assistant Examiner:

Long Le

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/48 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H01L 23/13 (2006.01); H01L 23/15 (2006.01); H01L 23/00 (2006.01); H05K 3/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/48 (2013.01); H01L 21/486 (2013.01); H01L 23/13 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01); H05K 1/0271 (2013.01); H05K 3/4605 (2013.01); H01L 23/49822 (2013.01); H01L 24/81 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81192 (2013.01); H01L 2924/15311 (2013.01); H05K 3/0047 (2013.01); H05K 3/0052 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/068 (2013.01);
Abstract

A wiring substrate includes: a core substrate made of glass and having: a first surface; a second surface opposite to the first surface; and a side surface between the first surface and the second surface; and an insulating layer and a wiring layer, which are formed on at least one of the first surface and the second surface of the core substrate. A plurality of concave portions are formed in the side surface of the core substrate to extend from the first surface to the second surface, and a resin is filled in the respective concave portions.

Find Patent Forward Citations

Koizumi, Naoyuki. (2015). Wiring substrate and manufacturing method thereof (U.S. Patent No. 9159648). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9159648

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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