Nagano, Japan

Jun Furuichi


Average Co-Inventor Count = 2.3

ph-index = 4

Forward Citations = 105(Granted Patents)


Company Filing History:


Years Active: 2015-2021

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14 patents (USPTO):

Title: Innovations of Jun Furuichi

Introduction

Jun Furuichi is a notable inventor based in Nagano, Japan. He has made significant contributions to the field of wiring substrates and semiconductor devices. With a total of 14 patents to his name, Furuichi's work has had a considerable impact on technology.

Latest Patents

Furuichi's latest patents include a wiring substrate that features a first insulation layer made of insulating resin. This substrate contains a first through hole that passes through the insulation layer, with a pad formed within it. Additionally, a second insulation layer is laminated on the first surface of the first insulation layer, and a first wiring layer connects to the pad. Notably, the connecting surface of the pad has a curved surface that protrudes toward the first surface of the insulation layer. Another patent involves a semiconductor device where a first insulation layer has a concave portion. A first wiring layer is formed within this concave area, and a protective insulation layer is stacked on top, exposing part of the wiring layer. An adhesion layer is interposed between the wiring layer and the protective layer, enhancing the device's functionality.

Career Highlights

Furuichi is currently employed at Shinko Electric Industries Co., Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of wiring substrates and semiconductor devices.

Collaborations

Furuichi has collaborated with notable coworkers, including Noriyoshi Shimizu and Naoyuki Koizumi. Their combined expertise has contributed to the success of various projects and patents.

Conclusion

Jun Furuichi's contributions to the field of technology through his patents and collaborations highlight his role as a leading inventor. His work continues to influence advancements in wiring substrates and semiconductor devices.

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