The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
Aug. 21, 2018
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano-ken, JP;
Jun Furuichi, Nagano, JP;
Abstract
A wiring substrate includes a first wiring structure. The first wiring structure has a first insulation layer including a reinforcement material. A first wiring layer is embedded in the first insulation layer. A second wiring structure having a higher wiring density than the first wiring structure is formed on the first insulation layer. The second wiring structure includes at least one second insulation layer and two or more second wiring layers. A lower surface of the first wiring layer is flush with a lower surface of the first insulation layer. The reinforcement material is located toward the second wiring structure from a thickness-wise center of the first insulation layer and laid out at a thickness-wise center of a thickness from the lower surface of the first insulation layer to an upper surface of the uppermost second wiring layer in the second wiring structure.