Nagano, Japan

Yasuhito Takahashi

This inventor holds 20 USPTO granted patents, primarily in Circuit Board Technology. Top assignee: Fujitsu Corporation. Active years: 1997-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasuhito Takahashi. Retrieved from https://idiyas.com/inventor/yasuhito-takahashi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 80.0

Average Co-Inventor Count = 5.3

ph-index = 11

Forward Citations = 678(Granted Patents)


Location History:

  • San Jose, CA (US) (1999 - 2003)
  • Kawasaki, JP (1997 - 2006)
  • Nagano, JP (2004 - 2009)
  • Sunnyvale, CA (US) (2014)

Company Filing History:


Years Active: 1997-2014

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Areas of Expertise:
Package Substrate
Multilayer Circuit Boards
Optical Coupling
Electrical Assemblies
Signal Interposer
Conductive Composition
Thin Circuit Board
Venting Hole Designs
Power Conducting Substrates
High Density Signal
Flip Chip Pre-Assembly
Core Layer
20 patents (USPTO):Explore Patents

Title: **Innovator Spotlight: Yasuhito Takahashi**

Introduction

Yasuhito Takahashi, an accomplished inventor based in Nagano, Japan, has made significant contributions to the field of semiconductor technology. With an impressive portfolio comprising 20 patents, Takahashi has been pivotal in the development of advanced electronic components and circuit board innovations.

Latest Patents

Among his recent inventions, Takahashi has developed the "Package substrate unit and method for manufacturing package substrate unit." This innovative design features a semiconductor chip mounting layer that includes an insulation layer, a conductive seed metal layer, conductive pads, metal posts, and a solder resist layer. This configuration enhances the functionality and reliability of electronic packages.

Another key patent from Takahashi is the "Method of embedding components in multi-layer circuit boards." This method focuses on producing circuit boards with integrated electronic components by securing them to a substrate and layering dielectric materials with metallic layers. This innovative approach results in circuit boards that effectively integrate prefabricated electronic components, thereby advancing the capabilities of electronic devices.

Career Highlights

Takahashi is currently affiliated with Fujitsu Corporation, a prominent player in the technology industry. His work at Fujitsu entails pushing the boundaries of semiconductor technology and enhancing product designs, which demonstrates his commitment to innovation and excellence.

Collaborations

Throughout his career, Yasuhito Takahashi has collaborated with talented engineers and inventors, including Solomon I Beilin and Wen-chou Vincent Wang. These collaborations have led to the successful development of groundbreaking technologies and enhancements in the electronic components field.

Conclusion

Yasuhito Takahashi stands out as a remarkable inventor whose work has significantly advanced the landscape of semiconductor technology. His contributions, particularly in the area of integrated circuit board designs, underscore his innovative spirit and dedication to creating solutions that foster the growth of modern electronics. As he continues to push the envelope in his field, Takahashi serves as an inspiration for future inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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