The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2014
Filed:
Feb. 08, 2011
Hnin Nway San Nang, Kawasaki, JP;
Kazuya Arai, Kawasaki, JP;
Kei Fukui, Kawasaki, JP;
Shinpei Ikegami, Kawasaki, JP;
Yasuhito Takahashi, Sunnyvale, CA (US);
Hideaki Yoshimura, Kawasaki, JP;
Hitoshi Suzuki, Kawasaki, JP;
Hnin Nway San Nang, Kawasaki, JP;
Kazuya Arai, Kawasaki, JP;
Kei Fukui, Kawasaki, JP;
Shinpei Ikegami, Kawasaki, JP;
Yasuhito Takahashi, Sunnyvale, CA (US);
Hideaki Yoshimura, Kawasaki, JP;
Hitoshi Suzuki, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.