The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2002
Filed:
Dec. 01, 2000
Applicant:
Inventors:
Yasuhito Takahashi, Kawasaki, JP;
Yasunaga Kurokawa, Kawasaki, JP;
Kenji Iida, Kawasaki, JP;
Masaru Sumi, Yonago, JP;
Yuichiro Ohta, Yonago, JP;
Toshiro Katsube, Yonago, JP;
Kazuo Nakano, Kawasaki, JP;
Norikazu Ozaki, Kawasaki, JP;
Hiroyuki Katayama, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 ;
U.S. Cl.
CPC ...
H05K 3/36 ;
Abstract
A process for fabricating thin multi-layer circuit boards. A substrate is disposed over a heat-accumulating block adjacent thereto so that it is uniformly heated from the back side thereof during the pre-baking.
Takahashi, Yasuhito. (2002). Process for fabricating a thin multi-layer circuit board (U.S. Patent No. 6389686). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6389686
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile