Company Filing History:
Years Active: 1997-2002
Title: Yasunaga Kurokawa: Innovator in Multi-layer Circuit Board Technology
Introduction
Yasunaga Kurokawa is a notable inventor based in Kawasaki, Japan, recognized for his significant contributions to the field of electronic circuit board technology. With three patents to his name, Kurokawa specializes in processes for fabricating advanced multi-layer circuit boards, instrumental in the advancement of electronic devices.
Latest Patents
Kurokawa's latest patents demonstrate his innovative approach to circuit board fabrication. One of his key inventions is a "Process for fabricating a thin multi-layer circuit board." This process involves placing a substrate over a heat-accumulating block, ensuring uniform heating from the back during pre-baking, which enhances the quality and durability of the circuit boards.
Another significant patent is for a "Thin multi-layer circuit board having a remodeling pad layer and a metallic barrier layer with an exclusion zone." This invention features alternately stacked wiring pattern layers, allowing electronic connections through vias in insulating layers to create a predetermined circuit pattern. Moreover, it includes a metallic barrier layer formed on the top wiring pattern layer, strategically designed with exclusion zones to optimize performance and functionality.
Career Highlights
Kurokawa is associated with Fujitsu Corporation, a leading technology company in Japan. His work within the company has paved the way for notable advancements in circuit board technology, solidifying Fujitsu's reputation in the electronic industry. His expertise and innovative practices have contributed significantly to the efficiency and effectiveness of modern electronic applications.
Collaborations
Throughout his career, Kurokawa has collaborated with accomplished coworkers, including Yasuhito Takahashi and Kenji Iida. These partnerships have fostered a creative environment, enabling the development of groundbreaking technologies in the realm of circuit boards.
Conclusion
Yasunaga Kurokawa stands out as a prominent inventor whose patents are pivotal in the evolution of multi-layer circuit board technology. His innovative processes and collaborative efforts within Fujitsu Corporation highlight his commitment to advancing electronic design and manufacturing for the future. Kurokawa's work not only enhances the performance of electronic devices but also sets a benchmark for future innovations in the industry.