The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2001
Filed:
Jun. 18, 1997
Yasuhito Takahashi, Kawasaki, JP;
Yasunaga Kurokawa, Kawasaki, JP;
Kenji Iida, Kawasaki, JP;
Masaru Sumi, Yonago, JP;
Yuichiro Ohta, Yonago, JP;
Toshiro Katsube, Yonago, JP;
Kazuo Nakano, Kawasaki, JP;
Norikazu Ozaki, Kawasaki, JP;
Hiroyuki Katayama, Kawasaki, JP;
Fujitsu Ltd., Kawasaki, JP;
Abstract
A thin multi-layer circuit board having alternately stacked wiring pattern layers, including a top wiring pattern layer and insulating layers on an insulating plate-like substrate. The wiring pattern layers are electronically connected through vias in the insulating layers to form a predetermined circuit pattern by said wiring pattern layers. A metallic barrier layer is formed on the top wiring pattern layer, except at an exclusion zone of the metallic barrier layer. An electronic part-mounting pad layer and a remodeling pad layer are formed on the metallic barrier layer. The remodeling pad layer is arranged adjacent the electronic part-mounting pad layer, with the exclusion zone therebetween.