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For the Inventor, By the Inventor

Kawasaki, Japan

Norikazu Ozaki

USPTO Granted Patents = 15 

Average Co-Inventor Count = 3.8

ph-index = 4

Forward Citations = 65(Granted Patents)


Location History:

  • Kawasaki, JP (1996 - 2014)
  • Nagano, JP (2018)

Company Filing History:

goldMedal15 out of 39,228 
 
Fujitsu Corporation
 patents

Years Active: 1996-2018

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15 patents (USPTO):
1. 10009998 - Method of manufacturing substrate and substrate (2018-06-26),
2. 8642894 - Circuit board, method of manufacturing the same, and resistance element (2014-02-04),
3. 8186052 - Method of producing substrate (2012-05-29),
4. 8153908 - Circuit board and method of producing the same (2012-04-10),
5. 8151456 - Method of producing substrate (2012-04-10),
6. 8035037 - Core substrate and method of producing the same (2011-10-11),
7. 7197813 - Method of accurate evaluation on magnetoresistive read element (2007-04-03),
8. 6526654 - Method of producing double-sided circuit board (2003-03-04),
9. 6465085 - Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the same (2002-10-15),
10. 6399897 - Multi-layer wiring substrate (2002-06-04),
11. 6389686 - Process for fabricating a thin multi-layer circuit board (2002-05-21),
12. 6184476 - Thin multi-layer circuit board having a remodeling pad layer and a metallic barrier layer with an exclusion zone (2001-02-06),
13. 6171514 - Polishing method for planarizing a substrate (2001-01-09),
14. 5679268 - Thin multi-layer circuit board and process for fabricating the same (1997-10-21),
15. 5578186 - Method for forming an acrylic resist on a substrate and a fabrication (1996-11-26),

Title: Norikazu Ozaki: Innovator in Substrate Manufacturing

Introduction

Norikazu Ozaki is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the field of substrate manufacturing, holding a total of 15 patents. His innovative work has paved the way for advancements in circuit board technology and resistance elements.

Latest Patents

Ozaki's latest patents include a method of manufacturing a substrate, which involves forming a first through hole in a base and creating a conductive layer that covers the inner wall of the hole. A columnar electric conductor, characterized by a Vickers hardness between 30 Hv and 400 Hv, is inserted into the hole. Pressure is then applied to the conductor to form a second through hole. Another notable patent is for a circuit board that features a resin base and a resistance element. This resistance element includes a resistance pattern with an electrode portion and an extending portion, designed to enhance the functionality of the circuit board.

Career Highlights

Ozaki has built a successful career at Fujitsu Corporation, where he has been instrumental in developing cutting-edge technologies. His expertise in substrate manufacturing has led to numerous innovations that benefit the electronics industry.

Collaborations

Throughout his career, Ozaki has collaborated with talented individuals such as Kenji Iida and Tomoyuki Abe. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of new technologies.

Conclusion

Norikazu Ozaki's contributions to substrate manufacturing and circuit board technology highlight his role as a leading inventor in the field. His innovative patents and collaborations continue to influence advancements in electronics.

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