The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2001
Filed:
Mar. 03, 1998
Kouichi Hara, Kawasaki, JP;
Norikazu Ozaki, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A polishing method for planarizing a substrate which provides an efficient polishing so that a time needed for polishing is reduced as compared to the conventional method. A first polishing process removes a portion of a polish stop layer that covers a high area by using a first slurry having a high polishing capability against the polish stop layer. A second polishing process, subsequent to the first polishing process, removes the high area by using a second slurry having a high polishing capability for polishing a material covered by the polish stop layer. A polishing capability of the second slurry for polishing the polish stop layer is lower than the polishing capability of the first slurry for polishing the polish stop layer.