The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2002
Filed:
Oct. 31, 2000
Zhiyi Song, Kawasaki, JP;
Kiyokazu Moriizumi, Kawasaki, JP;
Takami Sasahara, Kawasaki, JP;
Norikazu Ozaki, Kawasaki, JP;
Manabu Watanabe, Kawasaki, JP;
Misao Umematsu, Kawasaki, JP;
Shunichi Kikuchi, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A dummy pad is formed through a polyimide insulating layer so as to be provided opposite to a via connecting pad formed on the surface of a ceramic substrate. A defect occurring in the via connecting pad is filled with a protrusion when the dummy pad is formed. Accordingly, the influence of the defect upon a layer above the dummy pad is prevented. Further, in a method for manufacturing a thin film wiring board obtained by forming a thin film layer on a base substrate having a via that allows interlayer electric conduction, a void defect existing in the via is filled with a conductive material having corrosion resistance against an etchant, and then the thin film layer is formed on the base substrate.