Takami Sasahara

Title: Takami Sasahara: Innovator in Thin Film Wiring Technology

Introduction

Takami Sasahara is a notable inventor based in Kawasaki, Japan. He has made significant contributions to the field of electrical engineering, particularly in the development of thin film wiring technology. His innovative approach has led to advancements that enhance the reliability and performance of electronic devices.

Latest Patents

Sasahara holds a patent for a "Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the same." This invention involves the formation of a dummy pad through a polyimide insulating layer, which is positioned opposite a via connecting pad on a ceramic substrate. The design addresses defects in the via connecting pad by filling them with a protrusion when the dummy pad is created. This method effectively prevents defects from impacting the layers above the dummy pad. Additionally, the manufacturing process includes filling void defects in the via with a corrosion-resistant conductive material before forming the thin film layer on the base substrate.

Career Highlights

Sasahara's career is marked by his work at Fujitsu Corporation, where he has been instrumental in advancing thin film technology. His expertise and innovative mindset have contributed to the company's reputation as a leader in electronic solutions.

Collaborations

Throughout his career, Sasahara has collaborated with talented individuals such as Zhiyi Song and Kiyokazu Moriizumi. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Takami Sasahara's contributions to thin film wiring technology exemplify the impact of innovation in the electronics industry. His patent and work at Fujitsu Corporation highlight his role as a key figure in advancing modern technology.