The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2011

Filed:

Jul. 10, 2008
Applicants:

Kenji Iida, Kawasaki, JP;

Tomoyuki Abe, Kawasaki, JP;

Yasutomo Maehara, Kawasaki, JP;

Shin Hirano, Kawasaki, JP;

Takashi Nakagawa, Kawasaki, JP;

Hideaki Yoshimura, Kawasaki, JP;

Seigo Yamawaki, Kawasaki, JP;

Norikazu Ozaki, Kawasaki, JP;

Inventors:

Kenji Iida, Kawasaki, JP;

Tomoyuki Abe, Kawasaki, JP;

Yasutomo Maehara, Kawasaki, JP;

Shin Hirano, Kawasaki, JP;

Takashi Nakagawa, Kawasaki, JP;

Hideaki Yoshimura, Kawasaki, JP;

Seigo Yamawaki, Kawasaki, JP;

Norikazu Ozaki, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

The core substrate is capable of securely preventing short circuit between an electrically conductive core section and a plated through-hole section. The core substrate comprises: an electrically conductive core section having a pilot hole, through which a plated through-hole section is formed; electrically conductive layers coating the inner face of the pilot hole and a surface of the core section; a gas purging hole being formed in the conductive layer coating the surface of the core section; an insulating material filling a space between the inner face of the pilot hole and an outer circumferential face of the plated through-hole section; and cable layers being laminated on both side faces of the core section.


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