The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2012
Filed:
Jul. 15, 2008
Kenji Iida, Kawasaki, JP;
Tomoyuki Abe, Kawasaki, JP;
Yasutomo Maehara, Kawasaki, JP;
Shin Hirano, Kawasaki, JP;
Takashi Nakagawa, Kawasaki, JP;
Hideaki Yoshimura, Kawasaki, JP;
Seigo Yamawaki, Kawasaki, JP;
Norikazu Ozaki, Kawasaki, JP;
Kenji Iida, Kawasaki, JP;
Tomoyuki Abe, Kawasaki, JP;
Yasutomo Maehara, Kawasaki, JP;
Shin Hirano, Kawasaki, JP;
Takashi Nakagawa, Kawasaki, JP;
Hideaki Yoshimura, Kawasaki, JP;
Seigo Yamawaki, Kawasaki, JP;
Norikazu Ozaki, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
The method of producing a substrate comprises the steps of: forming a through-hole in a base member; filling the through-hole with an insulating material; performing electroless plating to coat the surface of the base member, in which the through-hole has been filled with the insulating material, with an electroless-plated layer; applying photo resist on the electroless-plated layer formed on the surface of the base member; optically exposing and developing the photo resist so as to form a resist pattern coating an end face of the through-hole filled with the insulating material; etching an electrically conductive layer formed on the surface of the base member with using the resist pattern as a mask; and removing the resist pattern coating the end face of the through-hole from the base member with using the electroless-plated layer as a release layer.