The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2005
Filed:
Aug. 20, 2003
Motoaki Tani, Kawasaki, JP;
Nobuyuki Hayashi, Kawasaki, JP;
Tomoyuki Abe, Kawasaki, JP;
Yasuhito Takahashi, Kawasaki, JP;
Yoshiyasu Saeki, Kawasaki, JP;
Motoaki Tani, Kawasaki, JP;
Nobuyuki Hayashi, Kawasaki, JP;
Tomoyuki Abe, Kawasaki, JP;
Yasuhito Takahashi, Kawasaki, JP;
Yoshiyasu Saeki, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A wiring board includes a core layer and a pair of multilayer wiring portions. The core layer, having an upper surface and a lower surface, is formed from a resin composite which contains resin filler and encloses several pieces of carbon fiber cloth. One of the multilayer wiring portions is stacked on the upper surface of the core layer, while the other is stacked on the lower surface of the core layer. Each multilayer wiring portion is composed of a number of insulating layers and wiring patterns stacked alternately with the insulating layers. The wiring patterns of the upper and the lower wiring portions are connected to each other by conductors extending through the entire thickness of the core layer.