The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2001
Filed:
Dec. 22, 1998
Applicant:
Inventors:
Wen-chou Vincent Wang, Cupertino, CA (US);
Michael G. Peters, Santa Clara, CA (US);
Dashun S. Zhou, Sunnyvale, CA (US);
Yasuhito Takahashi, San Jose, CA (US);
Assignee:
Fujitsu Limited, , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/148 ;
U.S. Cl.
CPC ...
H01L 2/148 ;
Abstract
An encapsulation process for flip-chip bonding chips to a substrate encapsulates solder balls on the chip in a separate encapsulation process in which the chip is coated with encapsulation layer and then a portion of the encapsulation layer is removed to expose a portion of the solder balls.