Wen-chou Vincent Wang

Title: Innovations of Wen-chou Vincent Wang in Semiconductor Packaging

Introduction

Wen-chou Vincent Wang, a prominent inventor based in Cupertino, CA, has made significant contributions to the field of semiconductor packaging with a remarkable portfolio of 59 patents. His innovative designs and methodologies have paved the way for advancements in the efficiency and reliability of semiconductor devices.

Latest Patents

Among his latest patents, one focuses on a "Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate." This patent discusses semiconductor die flip chip packages where the management of package stresses is critical. By controlling the thickness of the die, the stress experienced by it can be minimized, thus enhancing the package's performance for low-K silicon dies or thin substrates. Additionally, this innovation includes the attachment of a thin die to a heat spreader, which increases rigidity and facilitates easier handling during fabrication.

Another notable patent is for a "Package substrate with dual material build-up layers." This invention integrates multi-layered organic build-up semiconductor package substrates, utilizing both fibrous and non-fibrous organic dielectric materials. This combination optimally positions these layers relative to signal metal layers and power/ground planes, achieving a balance of rigidity, strength, and fine resolution for signal metal lines.

Career Highlights

Wen-chou Vincent Wang has an impressive professional history, having worked at renowned companies such as Fujitsu Corporation and Altera Corporation. His experience in these leading technology firms has significantly influenced his innovative work and contributions to the semiconductor industry.

Collaborations

Wang has collaborated with notable colleagues in the field, including Solomon I Beilin and William T Chou. These collaborations have further enriched his research and innovation efforts, building a strong network of expertise around semiconductor technologies.

Conclusion

With a strong foundation in semiconductor packaging innovation, Wen-chou Vincent Wang continues to be a leading figure in his field. His numerous patents reflect his commitment to pushing the boundaries of technology and enhancing the performance of semiconductor devices. As the industry evolves, his contributions will undoubtedly pave the way for future advancements.