The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2012
Filed:
Aug. 12, 2009
Applicant:
Wen-chou Wang, Cupertino, CA (US);
Inventor:
Wen-Chou Wang, Cupertino, CA (US);
Assignee:
Altera Corporation, San Jose, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Multi-layered, organic build-up semiconductor package substrates have build-up layers with layers of both fibrous organic dielectric material and non-fibrous organic dielectric material. Non-fibrous dielectric material layers are positioned below the signal metal layers and fibrous dielectric material layers are positioned below the power/ground plane metal layers. The package substrate combines in a single package substrate the advantages of rigidity, strength and relatively low CTE of a fibrous material with the capacity of a non-fibrous material to achieve fine resolution signal metal lines.