The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2005

Filed:

Apr. 20, 1999
Applicants:

Tetsuzo Yoshimura, Sunnyvale, CA (US);

Yashuhito Takahashi, San Jose, CA (US);

Masaaki Inao, San Jose, CA (US);

Michael G. Lee, San Jose, CA (US);

William Chou, Cupertino, CA (US);

Solomon I. Beilin, San Carlos, CA (US);

Wen-chou Vincent Wang, Cupertino, CA (US);

James J. Roman, Sunnyvale, CA (US);

Thomas J. Massingill, Scotts Valley, CA (US);

Inventors:

Tetsuzo Yoshimura, Sunnyvale, CA (US);

Yashuhito Takahashi, San Jose, CA (US);

Masaaki Inao, San Jose, CA (US);

Michael G. Lee, San Jose, CA (US);

William Chou, Cupertino, CA (US);

Solomon I. Beilin, San Carlos, CA (US);

Wen-chou Vincent Wang, Cupertino, CA (US);

James J. Roman, Sunnyvale, CA (US);

Thomas J. Massingill, Scotts Valley, CA (US);

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 612 ;
U.S. Cl.
CPC ...
Abstract

Opto-electrical systems having electrical and optical interconnections formed in thin layers are disclosed. In one set of preferred embodiments, optical signals are conveyed between layers by respective vertical optical couplers disposed on the layers. In other preferred embodiments, optical signals are conveyed by stack optical waveguide coupling means. Yet other preferred embodiments have electrical via means formed in one or more layers to covey electrical signals between two or more layers.


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