Thomas Joel Massingill

Title: The Innovations of Thomas Joel Massingill

Introduction

Thomas Joel Massingill is a prominent inventor based in Scotts Valley, CA (US). He holds a total of 17 patents that showcase his contributions to the field of semiconductor technology. His work has significantly impacted the design and functionality of integrated circuit packages.

Latest Patents

Among his latest patents, Massingill has developed a "Die Down Semiconductor Package." This innovative semiconductor package allows for an integrated circuit die to be electrically connected to the package substrate using either die solder balls or wirebonds. The package substrate is a single-sided printed wiring board that features a thick metal core, which consists of a base metal, a core capacitor, and one or more thin build-up layers. Another notable patent is the "Semiconductor Package with Recess for Die." This design includes a recess for the integrated circuit die, created by bending or deforming all layers of the package substrate. The recess contains circuitry that connects to the integrated circuit die, which can also be electrically connected to the package substrate through wirebonds, TAB, or die solder balls.

Career Highlights

Throughout his career, Massingill has worked with leading companies in the technology sector, including Fujitsu Corporation and VLSI Technology, Inc. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor packaging.

Collaborations

Some of his notable coworkers include Wen-chou Vincent Wang and Michael G. Lee. Their collaborative efforts have further enhanced the innovations in the semiconductor field.

Conclusion

Thomas Joel Massingill's contributions to semiconductor technology through his patents and collaborations have made a lasting impact on the industry. His innovative designs continue to influence the development of integrated circuit packages.